A Study of the Intermetallic Compound Growth in Flip-Chip Packages under Thermal Loading

Quantitative reliability analysis of flip-chip packages under thermal-cyclic loading and in consideration of parameter uncertainties

Department of Business and Entrepreneurial Management, Kainan University, No. 1, Kainan Road, Luchu, Taoyuan 33857, Taiwan, ROC Department of Mechanical Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, Taipei 10617, Taiwan, ROC Department of Mechanical Engineering and Graduate Institute of Industrial Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Road, ...

Effect of glue on reliability of flip chip BGA packages under thermal cycling

Glue is widely used to improve the reliability of ball grid array (BGA) under mechanical shock and vibration. Although it has been demonstrated to have a positive effect on the reliability of BGA under mechanical impact, it can have adverse effects on BGA under thermal cycling. This paper investigates the effect of glue on the reliability of BGA under thermal cycling using both experimental and...

All-copper Chip-to-substrate Interconnections for Flip-chip Packages

gradual erasure of subjectivity: a study of samuel beckett’s trilogy in the light of postmodernism

ساموئل بکت بیشتر از هر نویسنده دیگری در نیم? دوم قرن بیستم با گفتارش زمان? ما را به آستان? از هم پاشیدگی کشانده است، آستانه ای که در آن مدرنیته با سرانجام گریزان اما غیرقابل اجتناب خود مواجه می شود. در این تحقیق روی مفهوم فردیت و محو آن در دوران پسامدرن تاکید شده و در طی آن سعی شده است که فردیت مدرن و پسامدرن در رمان های سه گانه بکت بررسی گردد. تحقیق حاضر یک بررسی کتابخانه ای و کیفی بر روی سه ر...

Analysis of Solder Joint Reliability in Flip Chip Packages

Fatigue damage of solder joints is a serious reliability concern in electronic packaging. In this study, a flip chip package was modeled to investigate the effects of underfill material properties and BT substrate thickness on solder joint reliability. The CTE was found to have the main effect and matching CTE between underfill and solder joint is the most important consideration in the selecti...